Search results for "BOND"
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05:43

POSCO International Issues Blockchain-Based Digital Bond, First Non-Financial Firm in South Korea

POSCO International issued Korea's first non-financial blockchain digital bond (about 1.4 trillion KRW) with HSBC as lead underwriter, cutting settlement to three days. Abstract: POSCO International issued a blockchain-based digital bond in a private placement of about 1.4 trillion KRW, with HSBC as sole lead underwriter, marking the first such issue by a South Korean non-financial company and the second digital bond in the country after Mirae Asset Securities. The bond uses blockchain for issuance, registration, trading, and settlement, offering enhanced security, faster settlement, and broader global investor access (three-day settlement vs. five). This follows POSCO’s prior blockchain-based payment system deployment and aligns with Hong Kong's subsidy program to promote digital bonds. POSCO and HSBC plan further collaboration in blockchain, digital finance, and transformation, including potential STO market participation.
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STO-7,05%
13:49
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Core Scientific Plans to Raise $3.3B Through Junk Bond Issuance for AI Infrastructure

Core Scientific aims to raise $3.3B with junk bonds to fund AI infrastructure; six data centers under a 12-year CoreWeave contract are expected to generate about $10B in revenue. Core Scientific intends to raise about $3.3 billion via junk-bond issuance to finance artificial intelligence infrastructure, aligning with a broader move by high-yield issuers into AI-related funding. The firm is constructing six data center facilities under a 12-year contract with CoreWeave, projected to yield approximately $10 billion in revenue over the term.
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