Apple Mac chips may in the future support flexible configurations of "basic CPU + top-tier GPU"

Tech News Home, February 3 — The technology media Wccftech published a blog post yesterday (February 2), reporting that Apple is expected to achieve physical separation of CPU and GPU through TSMC’s SoIC-mH packaging technology, allowing for customized configurations such as “basic CPU + top-tier GPU” based on user needs.

On February 1, Tech News Home reported that Apple adjusted the purchase interface for Mac products. Previously, after clicking to buy, users would see a series of “pre-set models” containing different chip, memory, and storage combinations, usually allowing them to select just one.

The new interface removed these preset options and directly guided users to a fully customizable page. Now, consumers must start by selecting the screen size and then manually choose each hardware specification one by one.

The media believes that Apple rarely adjusts functional UI without reason, and this redesign hints that the next-generation chips will bring unprecedented hardware customization “fineness,” allowing differentiation between CPU and GPU choices.

Currently, the M series chips use a System on Chip (SoC) design, with CPU and GPU tightly integrated on the same silicon die, which means their core counts must be sold in fixed ratios. If users want the highest GPU graphics performance, they are often forced to pay for a top-tier CPU they don’t need.

In the future, Apple is expected to differentiate CPU and GPU, allowing users to independently select the number of CPU and GPU cores—for example, pairing a “basic CPU + top-tier GPU” to meet specific professional needs.

Regarding technical implementation, Apple analyst Ming-Chi Kuo previously disclosed key technical details. He pointed out that the M5 Pro chip will be the first to adopt TSMC’s latest SoIC-mH (Integrated Chip System - Horizontal Molding) packaging process.

This technology not only enables higher component density and smaller package size, making it ideal for space-constrained portable devices like the MacBook Pro, but also significantly improves heat transfer efficiency through exposed thermal pads, ensuring sustained high performance.

Unlike traditional planar packaging, SoIC is a 3D packaging solution that supports stacking multiple chips (dies) vertically and horizontally, ultimately forming an integrated whole similar to an SoC.

Thanks to the introduction of SoIC technology, the M5 Pro and M5 Max chips are expected to achieve independent bare die integration of core components such as CPU, GPU, and neural engine. This means that when purchasing a Mac, users will no longer be limited to fixed processor configurations but can flexibly customize according to their needs.