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Synopsys and TSMC Advance AI Design Enablement Across Leading Nodes
Synopsys and TSMC are expanding their collaboration to advance AI-driven EDA, IP, and multiphysics design enablement across advanced semiconductor nodes and packaging technologies, including 3nm, 2nm, A16, and A14. This joint effort integrates digital, analog, and verification flows with 3D multi-die design and optical-to-electrical capabilities. The enhancements aim to improve multiphysics accuracy, accelerate development cycles for AI and high-performance computing systems, and support TSMC’s 3DFabric technologies for leading-edge silicon.